SUMMIT CORPORATION OF AMERICA

ELECTROPLATED MATERIALS SYSTEMS & TECHNOLOGY

 
 
 
 
 
 
 

Process Capabilities

We handle most precious and non-precious chemistries as shown below. Both individual parts and continuous plating requirements are plated overall and selectively.


 

 

 

 

 

 

 

 

 

 


 

Plating Capabilities

Continuous Coil Stock
• Overall and Selective
• .005 to .125 material thickness
• Widths from .5” to 14.0”

Continuous Stampings
• Overall and Selective

Wire Plating
    • Round, square and flat
    • Silver, Nickel, Tin, Trivalent Chrome and Palladium

 

Individual Parts
• Overall and Selective
• Vibratory Plating

 

 

Laboratory Capabilities

  • Plating Analysis and Solderability
  • Mechanical and S.E.M. analysis
  • Metallography and S.E.M. analysis
  • Report and PPAP Preparation